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A3P600-FGG484 +BOM

A3P600-FGG484 Field Programmable Gate Array

A3P600-FGG484 General Description

Microchip Technology's A3P600-FGG484 FPGA is a standout choice for engineers and designers seeking a powerful yet versatile solution for their application needs. With a formidable 600,000 system gates, this FPGA offers ample capacity for complex logic configurations. What sets it apart is its innovative Flash*Freeze technology, which delivers exceptionally low static power consumption, making it an environmentally friendly option that also contributes to cost savings. The device's reprogrammable flash technology allows for in-system programming, enabling flexibility and adaptability in various scenarios. Equipped with 293 user I/Os, the A3P600-FGG484 provides extensive connectivity options, while its support for high-speed interfaces like SPI, I2C, and UART ensures seamless integration into diverse systems. Additionally, the FPGA's security features, including non-volatile key storage and anti-tamper capabilities, make it an ideal choice for applications that demand robust data protection. Whether it's in the communications, industrial, or automotive sectors, the A3P600-FGG484 stands as a reliable and cost-effective solution for designs requiring moderate logic capacity and programmability, setting a new standard for versatility and performance

Key Features

  • High Capacity
  • 15 k to 1 M System Gates
  • Up to 144 kbits of True Dual-Port SRAM
  • Up to 300 User I/Os
  • Reprogrammable Flash Technology
  • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
  • Process
  • Live at Power-Up (LAPU) Level 0 Support
  • Single-Chip Solution
  • Retains Programmed Design when Powered Off
  • High Performance
  • 350 MHz System Performance
  • 3.3 V, 66 MHz 64-Bit PCI†
  • In-System Programming (ISP) and Security
  • Secure ISP Using On-Chip 128-Bit Advanced
  • Encryption Standard (AES) Decryption (except ARM®-
  • enabled ProASIC®3 devices) via JTAG (IEEE 1532–
  • compliant)†
  • FlashLock® to Secure FPGA Contents
  • Low Power
  • Core Voltage for Low Power
  • Support for 1.5 V-Only Systems
  • Low-Impedance Flash Switches
  • High-Performance Routing Hierarchy
  • Segmented, Hierarchical Routing and Clock Structure
  • Advanced I/O
  • 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
  • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
  • Bank-Selectable I/O Voltages—up to 4 Banks per Chip
  • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
  • 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and
  • LVCMOS 2.5 V / 5.0 V Input
  • Differential I/O Standards: LVPECL, LVDS, BLVDS, and
  • M-LVDS (A3P250 and above)
  • I/O Registers on Input, Output, and Enable Paths
  • Hot-Swappable and Cold Sparing I/Os‡
  • Programmable Output Slew Rate† and Drive Strength
  • Weak Pull-Up/-Down
  • IEEE 1149.1 (JTAG) Boundary Scan Test
  • Pin-Compatible Packages across the ProASIC3 Family
  • Clock Conditioning Circuit (CCC) and PLL†
  • Six CCC Blocks, One with an Integrated PLL
  • Configurable Phase-Shift, Multiply/Divide, Delay
  • Capabilities and External Feedback
  • Wide Input Frequency Range (1.5 MHz to 350 MHz)
  • Embedded Memory†
  • 1 kbit of FlashROM User Nonvolatile Memory
  • SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit
  • RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†
  • True Dual-Port SRAM (except ×18)
  • ARM Processor Support in ProASIC3 FPGAs
  • M1 and M7 ProASIC3 Devices—Cortex-M1 and
  • CoreMP7 Soft Processor Available with or without

Specifications

Series ProASIC3 Programmabe Not Verified
Total RAM Bits 110592 Number of I/O 235
Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ)
Base Product Number A3P600

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