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See Technical Specifications

EP3C25F324A7N +BOM

Advanced field-programmable gate array for electronic applications

Manufacturer:

Intel
Mfr.Part #:

EP3C25F324A7N
Datasheet:

EP3C25F324A7N Datasheet (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
HTS Code:

8542.39.00.01
JESD-30 Code:

S-PBGA-B324
EDA/CAD Models:

Request Free CAD Models for EP3C25F324A7N

EP3C25F324A7N General Description

A standout feature of the EP3C25F324A7N is its 65nm process technology, which contributes to its efficient performance and power consumption. For system integration, this FPGA provides 324 user I/O pins to facilitate connections with external devices and peripherals. Additionally, it includes various configuration options such as serial configuration and JTAG, enhancing its adaptability to different design requirements

Specifications

Part Life Cycle Code	Active	Reach Compliance Code	compliant
HTS Code	8542.39.00.01	JESD-30 Code	S-PBGA-B324
Length	19 mm	Number of CLBs	24624
Number of Inputs	215	Number of Logic Cells	24624
Number of Outputs	215	Number of Terminals	324
Operating Temperature-Max	125 °C	Operating Temperature-Min	-40 °C
Organization	24624 CLBS	Peak Reflow Temperature (Cel)	NOT SPECIFIED
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	3.5 mm	Supply Voltage-Max	2.625 V
Supply Voltage-Min	2.375 V	Supply Voltage-Nom	2.5 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	AUTOMOTIVE	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	Width	19 mm