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IS1870SF-102-TRAY +BOM

Bluetooth Low Energy System on a Chip.

IS1870SF-102-TRAY General Description

With the IS1870, designers can streamline their development process by integrating both transceiver and baseband functions, minimizing the need for external components. The included Bluetooth stack firmware further simplifies the integration process, allowing for quicker implementation of Bluetooth LE capabilities in your products

Microchip Technology, Inc Inventory

Key Features

  • Prioritized Memory Allocation
  • Enhanced Data Transfer Protocol
  • Efficient Power Management System
Microchip Technology, Inc Original Stock

Specifications

Category RF and WirelessRF Transceiver ICs Series -
Programmable Not Verified Type TxRx + MCU
RF Family/Standard Bluetooth Protocol Bluetooth v5.0
Modulation - Frequency 2.402GHz ~ 2.48GHz
Data Rate (Max) 921.6kbps Power - Output 0dBm
Sensitivity -90dBm Memory Size 256kB Flash, 32kB ROM, 24kB SRAM
Serial Interfaces ADC, I²C, PWM, SPI, UART GPIO 31
Voltage - Supply 1.9V ~ 3.6V Current - Receiving 13mA
Current - Transmitting 13mA Operating Temperature -20°C ~ 70°C (TA)
Mounting Type Surface Mount Base Product Number IS1870SF
Product Category RF System on a Chip - SoC Core 8051
Operating Frequency 2.4 GHz Output Power 0 dBm
Supply Voltage - Min 1.9 V Supply Voltage - Max 3.6 V
Supply Current Receiving 10 mA Supply Current Transmitting 10 mA
Program Memory Size 256 kB, 32 kB Minimum Operating Temperature - 20 C
Maximum Operating Temperature + 70 C ADC Resolution 12 bit
Data Bus Width 8 bit Data RAM Size 24 kB
Data RAM Type SRAM Height 0.9 mm
Interface Type I2C, SPI, UART Length 6 mm
Mounting Style SMD/SMT Number of ADC Channels 16 Channel
Number of I/Os 31 I/O Product Type RF System on a Chip - SoC
Program Memory Type Flash, ROM Factory Pack Quantity 490
Subcategory Wireless & RF Integrated Circuits Technology Si
Width 6 mm

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