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KLMCG8GEND-B031 +BOM

MLC NAND Flash Serial e-MMC 3V/3.3V 512G-bit 512G/128G/64G x 1/4-bit/8-bit 153-Pin FBGA

KLMCG8GEND-B031 General Description

Samsung's KLMCG8GEND-B031 is a top-of-the-line NAND flash memory module that packs a powerful 8-gigabyte capacity. With a BGA package type and a 153-ball configuration, this module is versatile and well-suited for use in smartphones, tablets, and other portable electronic devices. Operating on a 3.3-volt power supply, it boasts a high-speed interface for efficient data transfer, making it an ideal choice for data-intensive applications. Furthermore, the module is designed to deliver high performance and reliability, with a fast read and write speed that supports demanding tasks. It also incorporates error correction and wear-leveling algorithms, ensuring data integrity and extending the module's lifespan

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Key Features

  • Superior compatibility with major operating systems
  • Robust data encryption for enhanced security
  • Advanced error correction mechanisms
SAMSUNG Original Stock

Application

  • Robotic engineering
  • Medical equipment
  • Communication systems
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Specifications

Product Category IC Chips

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Packing

AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

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Ratings and Reviews

More
E
E**a 06/16/2020

Package arrived intact and Sensor works. Actual accuracy needs to be measured and tested.

13
L
L**n 03/20/2020

breadboard quality is good. Shipping to DE in 1 week.

5
I
I**c 03/01/2020

In appearance, i order nothing for the second time the first was with the bluetooth module for this has not yet checked

4

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In Stock: 7,072

Minimum Order: 1

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