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See Technical Specifications

M1A3PE1500-2FGG676 +BOM

Ultra Low Density FPGAs.

Manufacturer:

MICROCHIP TECHNOLOGY INC
Mfr.Part #:

M1A3PE1500-2FGG676
Datasheet:

M1A3PE1500-2FGG676 Datasheet (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
HTS Code:

8542.39.00.01
Clock Frequency-Max:

350 MHz
EDA/CAD Models:

Request Free CAD Models for M1A3PE1500-2FGG676

M1A3PE1500-2FGG676 General Description

Security is a top priority with the M1A3PE1500-2FGG676 FPGA, offering features such as secure boot, anti-tamper protection, and bitstream encryption to ensure that intellectual property and sensitive data are safeguarded. These security features give designers peace of mind, knowing that their designs are protected from potential threats. With the M1A3PE1500-2FGG676 FPGA, engineers can focus on pushing the boundaries of what is possible, knowing that their designs are backed by robust security features

Key Features

The device has two 36-bit DDR3/DDR3L/LPDDR
memory interfaces
and 18 differential high speed transceivers

Specifications

Part Life Cycle Code	Active	Reach Compliance Code	compliant
HTS Code	8542.39.00.01	Clock Frequency-Max	350 MHz
JESD-30 Code	S-PBGA-B676	JESD-609 Code	e1
Length	27 mm	Moisture Sensitivity Level	3
Number of CLBs	38400	Number of Equivalent Gates	1500000
Number of Inputs	444	Number of Logic Cells	38400
Number of Outputs	444	Number of Terminals	676
Operating Temperature-Max	70 °C	Operating Temperature-Min
Organization	38400 CLBS, 1500000 GATES	Packing Method	TRAY
Peak Reflow Temperature (Cel)	250	Power Supplies	1.5/3.3 V
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2.44 mm	Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.425 V	Supply Voltage-Nom	1.5 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	COMMERCIAL	Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	27 mm