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Single-Level Cell NAND Flash
FBGAManufacturer:
Mfr.Part #:
MT29F2G08ABAEAH4-IT
Datasheet:
Part Life Cycle Code:
Active
Reach Compliance Code:
compliant
ECCN Code:
EAR99
HTS Code:
8542.32.00.51
EDA/CAD Models:
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Part Life Cycle Code | Active | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Access Time-Max | 20 ns | Command User Interface | YES |
JESD-30 Code | R-PBGA-B63 | Length | 11 mm |
Memory Density | 2147483648 bit | Memory IC Type | FLASH |
Memory Width | 8 | Number of Functions | 1 |
Number of Sectors/Size | 2K | Number of Terminals | 63 |
Number of Words | 268435456 words | Number of Words Code | 256000000 |
Operating Mode | ASYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 256MX8 |
Page Size | 2K words | Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | Programming Voltage | 3.3 V |
Ready/Busy | YES | Seated Height-Max | 1.25 mm |
Sector Size | 128K | Standby Current-Max | 0.0001 A |
Supply Current-Max | 0.035 mA | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.7 V | Supply Voltage-Nom (Vsup) | 3.3 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | Type | SLC NAND TYPE |
Width | 9 mm |
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