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See Technical Specifications

MT53E256M32D2DS-053 AAT:B +BOM

IC DRAM 8GBIT 1.866GHZ 200WFBGA

Manufacturer:

Micron Semiconductor Products Inc
Mfr.Part #:

MT53E256M32D2DS-053 AAT:B
Datasheet:

MT53E256M32D2DS-053 AAT:B Datasheet (PDF)
Type:

SDRAM Mobile - LPDDR4
Mounting Style:

SMD/SMT
Data Bus Width:

32 bit
Organization:

256 M x 32
EDA/CAD Models:

Request Free CAD Models for MT53E256M32D2DS-053 AAT:B

MT53E256M32D2DS-053 AAT:B General Description

This memory module features a compact package size of 11.5mm x 13mm and a ball grid array (BGA) form factor, facilitating easy integration into small and space-constrained designs. Its advanced technologies like on-die termination (ODT) and dual data rate (DDR) architecture ensure high-speed data transfer with enhanced signal integrity. With a wide temperature range of -40°C to 105°C, the MT53E256M32D2DS-053 AAT:B is well-suited for harsh operating conditions, making it a reliable choice for demanding applications

Micron Semiconductor Products Inc Inventory

Micron Semiconductor Products Inc Original Stock

Specifications

Product Category:	DRAM	Type:	SDRAM Mobile - LPDDR4
Mounting Style:	SMD/SMT	Data Bus Width:	32 bit
Organization:	256 M x 32	Memory Size:	8 Gbit
Maximum Clock Frequency:	1.866 GHz	Supply Voltage - Max:	1.1 V
Minimum Operating Temperature:	- 40 C	Maximum Operating Temperature:	+ 105 C
Series:	MT53E	Packaging:	Tray
Height:	12/4/19	Moisture Sensitive:	Yes
Product Type:	DRAM	Factory Pack Quantity:	1360
Subcategory:	Memory & Data Storage	Unit Weight:	0.169812 oz
Programmabe	Not Verified	Memory Type	Volatile
Memory Format	DRAM	Technology	SDRAM - Mobile LPDDR4
Memory Size	8Gbit	Memory Organization	256M x 32
Clock Frequency	1.866 GHz	Voltage - Supply	1.1V
Operating Temperature	-40°C ~ 105°C (TC)	Grade	Automotive
Qualification	AEC-Q100	Mounting Type	Surface Mount
Base Product Number	MT53E256