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See Technical Specifications

OPB840W11Z +BOM

Optek OPB840W11Z

Manufacturer:

TT Electronics/Optek Technology
Mfr.Part #:

OPB840W11Z
Datasheet:

OPB840W11Z Datasheet (PDF)
Sensing Distance:

0.125" (3.18mm)
Sensing Method:

Through-Beam
Output Configuration:

Phototransistor
Current - DC Forward (If) (Max):

50 mA
EDA/CAD Models:

Request Free CAD Models for OPB840W11Z

OPB840W11Z General Description

The OPB840W11Z reflective object sensor is a key component for any project that requires precise object detection capabilities. From industrial automation to consumer electronics, this sensor offers a sensing distance of up to 3.81mm and a high-speed response time of 8μs, ensuring quick and accurate detection of a variety of materials. With its compact design and integrated lens, the sensor is easy to incorporate into existing systems, making it a versatile and reliable choice for a wide range of applications

Key Features

Each device in this series provides the flexibility of a custom device from a standard product line. Building from a standard housing with a 0.125" (3.175 mm) wide slot, a user can choose aperture width, opaque or IR transmissive housing shell material, PCBoard lead spacing or wires and mounting tab configuration. Housings are made from an opaque grade of injection-molded plastic to minimize sensitivity to both visible and near-infrared light. Discrete shells exposed on the parallel faces inside each device's throat are made from either IR transmissive plastic (for applications where dust protection is needed) or from opaque plastic with apertureopenings (for applications that require maximum protection against ambient light).Applications:

Non-contact object sensing

Assembly line automation

Machine automation

Equipment safety

Machine safety Features:

0.125" (3.175 mm) slot width

Choice of aperture (0.050" or 0.010" width)

Choice of opaque or IR transmissive shell material

Choice of mounting configurations

Choice of lead spacing or wires

Application

Non-contact interruptive object sensing

Assembly line automation

Machine automation

Equipment security

Machine safety

Specifications

Sensing Distance	0.125" (3.18mm)	Sensing Method	Through-Beam
Output Configuration	Phototransistor	Current - DC Forward (If) (Max)	50 mA
Current - Collector (Ic) (Max)	30 mA	Voltage - Collector Emitter Breakdown (Max)	30 V
Response Time	-	Operating Temperature	-40°C ~ 80°C
Mounting Type	Chassis Mount