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See Technical Specifications

PCIMX6S6AVM08AB +BOM

High Performance Application Processor IC

Manufacturer:

NXP Semiconductor
Mfr.Part #:

PCIMX6S6AVM08AB
Datasheet:

PCIMX6S6AVM08AB Datasheet (PDF)
Place:

China
Last_inspection_date:

21 MAR 2023
Supplier_cage_code:

H1R01
Htsusa:

8542310001
EDA/CAD Models:

Request Free CAD Models for PCIMX6S6AVM08AB

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

PCIMX6S6AVM08AB General Description

The i.MX 6 series of applications processors combines scalable platforms with broad levels of integration and power-efficient processing capabilities particularly suited to multimedia applications. The i.MX 6Solo processor features:Enhanced capabilities of high-tier portable applications by fulfilling MIPS needs of operations systems and gamesMultilevel memory systemSmart speed technology that enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectationsDynamic voltage and frequency scalingPowerful graphics accelerationInterface flexibilityIntegrated power management throughout the deviceAdvanced hardware-enabled securityThe i.MX 6Solo is supported by companion power management ICs (PMIC) MMPF0100, MMPF0200 and PF3001.i.MX 6 applications processors are part of NXP'sEdgeVerse? edge computing platform.

Key Features

CPU Complex
1x Arm
512 KB L2 cache
32 KB instruction and data caches
NEON SIMD media accelerator
Multimedia
GPU 3D
Vivante GC880
35Mtri/s 266Mpxl/s Open GL ES 2.0
GPU 2D(Vector Graphics)
Emulated on GPU 3D
GPU 2D(Composition)
Vivante GC320
600Mpxl/s, BLIT
Video Decode
1080p30 + D1
Video Encode
1080p30 H.264 BP/ Dual 720p encode
Camera Interface
Types: 1x 20-bit parallel, MIPI-CSI2 (2 lanes)
Memory
DDR
32 bit LP-DDR3/LV-DDR3
NAND
SLC/MLC, 40-bit ECC, ONFI2.2, DDR
Connectivity
Automotive
FlexCAN
MLB
Four USB2.0
1x HS OTG + PHY
1x Host + PHY
2x Host USB HSIC
Ethernet
1 Gbps + IEEE
1588
Expansion Ports
3x SD/MMC 4.4, 1x SDXC
4x SPI, 5x UART, 3x I2C
MIPI-HSI
PCIe 2.0 (1 lane)
Display
2 x WXGA (1366x786)
EPDC, LVDS, Parallel, MIPI-DSI
Advanced Power Management
PMU integration
NXP
Security
Advanced security supporting:
High Assurance Boot
Cryptographic cipher engines
Random number generator
Tamper detection
Package and Temperature
21 x 21 mm 0.8 mm BGA
Consumer (0C to +95C), up to 1 GHz
Industrial (-40C to +105C), up to 800 MHz
Automotive (-40C to +125C), AEC-Q100, up to 800 MHz GHz

Application

Automotive
Industrial
Mobile
Smart City
Smart Home

Specifications

place	China	launch_date
last_inspection_date	21 MAR 2023	supplier_cage_code	H1R01
htsusa	8542310001	schedule_b	8542310000
ppap	True	aec