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See Technical Specifications

TDA3MVDBABFRQ1 +BOM

Compact and high-reliability pin FCBGA package for space-constrained designs

Manufacturer:

Texas Instruments, Inc
Mfr.Part #:

TDA3MVDBABFRQ1
Datasheet:

TDA3MVDBABFRQ1 Datasheet (PDF)
GenericPartNumber:

TDA3MV
PartDescription:

Low power SoC w/ full-featured processing, imaging & vision acceleration for ADAS applications
EDA/CAD Models:

Request Free CAD Models for TDA3MVDBABFRQ1

TDA3MVDBABFRQ1 General Description

Automotive technology is advancing at a rapid pace, and the TDA3x SoC is at the forefront of this evolution. From front cameras to radar systems, the TDA3x SoC supports a wide range of ADAS applications on a single architecture. This versatility is made possible by its heterogeneous and scalable design, which includes a mix of powerful DSP cores, Vision AccelerationPac (EVE), and Cortex-M4 processors. With integrated peripherals like multi-camera interfaces and Ethernet connectivity, the TDA3x SoC is a comprehensive solution for next-generation automotive systems

Key Features

Reliable temperature monitoring

Specifications

genericPartNumber	TDA3MV	orderablePartNumber	TDA3MVDBABFRQ1
partDescription	Low power SoC w/ full-featured processing, imaging & vision acceleration for ADAS applications	statusDisplay	ACTIVE
statusDescription	This product has been released to the market and is available for purchase. For some products, newer alternatives may be available.