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XC5VLX30-1FFG676I +BOM
BGA package with 676 pins
FBGA-676-
Manufacturer:
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Mfr.Part #:
XC5VLX30-1FFG676I
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Datasheet:
-
Pbfree Code:
Yes
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Part Life Cycle Code:
Transferred
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Pin Count:
676
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Reach Compliance Code:
not_compliant
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Availability: 7302 PCS
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XC5VLX30-1FFG676I General Description
The XC5VLX30-1FFG676I is a powerful member of the Virtex-5 family of FPGAs from Xilinx. With 30,000 logic cells and a 65nm process technology, it offers high performance and versatility for a variety of applications. The 676-pin flip-chip fine-pitch ball grid array package makes it suitable for surface-mount assembly, and the industrial temperature range grade ensures reliable operation in harsh environmental conditions. Whether in telecommunications, aerospace, defense, or industrial automation, the XC5VLX30-1FFG676I is a reliable choice for demanding applications
Specifications
Pbfree Code | Yes | Part Life Cycle Code | Transferred |
Pin Count | 676 | Reach Compliance Code | not_compliant |
ECCN Code | 3A991.D | HTS Code | 8542.39.00.01 |
Factory Lead Time | 72 Weeks | Combinatorial Delay of a CLB-Max | 0.9 ns |
JESD-30 Code | S-PBGA-B676 | JESD-609 Code | e1 |
Length | 27 mm | Moisture Sensitivity Level | 4 |
Number of CLBs | 2400 | Number of Inputs | 400 |
Number of Logic Cells | 30720 | Number of Outputs | 400 |
Number of Terminals | 676 | Operating Temperature-Max | 100 °C |
Operating Temperature-Min | -40 °C | Organization | 2400 CLBS |
Peak Reflow Temperature (Cel) | 250 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 3 mm |
Supply Voltage-Max | 1.05 V | Supply Voltage-Min | 0.95 V |
Supply Voltage-Nom | 1 V | Surface Mount | YES |
Temperature Grade | INDUSTRIAL | Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL | Terminal Pitch | 1 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 27 mm |
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In Stock: 7,302
Minimum Order: 1
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