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H5TQ1G63DFR-H9C +BOM

DDR DRAM, 64MX16, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96

Key Features

  • VDD=VDDQ=1.5V +/- 0.075V
  • Fully differential clock inputs (CK, CK) operation
  • Differential Data Strobe (DQS, DQS)
  • On chip DLL align DQ, DQS and DQS transition with CK 
  • transition
  • DM masks write data-in at the both rising and falling 
  • edges of the data strobe
  • All addresses and control inputs except data, 
  • data strobes and data masks latched on the 
  • rising edges of the clock
  • Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13
  • and 14 supported
  • Programmable additive latency 0, CL-1, and CL-2 
  • supported
  • Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10
  • Programmable burst length 4/8 with both nibble 
  • sequential and interleave mode
  • BL switch on the fly
  • 8banks
  • Average Refresh Cycle (Tcase of0 oC~ 95oC)
  • - 7.8 µs at 0oC ~ 85 oC
  • - 3.9 µs at 85oC ~ 95 oC
  • JEDEC standard 78ball FBGA(x4/x8)
  • Driver strength selected by EMRS
  • Dynamic On Die Termination supported
  • Asynchronous RESET pin supported
  • ZQ calibration supported
  • TDQS (Termination Data Strobe) supported (x8 only)
  • Write Levelization supported
  • 8 bit pre-fetch
  • This product in compliance with the RoHS directive.

Specifications

Part Life Cycle Code Obsolete Pin Count 96
Reach Compliance Code ECCN Code EAR99
HTS Code 8542.32.00.32 Access Mode MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH Clock Frequency-Max (fCLK) 667 MHz
I/O Type COMMON Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B96 JESD-609 Code e1
Length 13 mm Memory Density 1073741824 bit
Memory IC Type DDR3 DRAM Memory Width 16
Number of Functions 1 Number of Ports 1
Number of Terminals 96 Number of Words 67108864 words
Number of Words Code 64000000 Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 64MX16 Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) 260 Power Supplies 1.5 V
Qualification Status Not Qualified Refresh Cycles 8192
Seated Height-Max 1.2 mm Self Refresh YES
Sequential Burst Length 4,8 Standby Current-Max 0.01 A
Supply Current-Max 0.2 mA Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES Technology CMOS
Temperature Grade OTHER Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 20
Width 7.5 mm

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