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IRF9956PBF +BOM

8-Pin Small Outline Integrated Circuit (SOIC) Package

Avaq Semiconductor offers the highly versatile and reliable IRF9956PBF driver, produced by Infineon Technologies Ag. With its multifunctional and high-performance capabilities, this component is an excellent choice for a wide range of electronic projects.

To ensure that you have all the necessary information to make the most of this component, Avaq provides a free datasheet PDF, as well as circuit diagrams, pin layouts, pin details, pin voltage ratings, and equivalent components for the  IRF9956PBF.

Avaq also offers free samples. Simply fill out and submit the sample request form to receive your free samples for testing. If you have any questions, please feel free to contact us at any time.

Specifications

ECCN (US) EAR99 Part Status Obsolete
HTS 8541.21.00.95 Automotive No
PPAP No Category Power MOSFET
Material Si Configuration Dual Dual Drain
Process Technology HEXFET Channel Mode Enhancement
Channel Type N Number of Elements per Chip 2
Maximum Drain Source Voltage (V) 30 Maximum Gate Source Voltage (V) ±20
Maximum Gate Threshold Voltage (V) 1(Min) Operating Junction Temperature (°C) -55 to 150
Maximum Continuous Drain Current (A) 3.5 Maximum Gate Source Leakage Current (nA) 100
Maximum IDSS (uA) 2 Maximum Drain Source Resistance (mOhm) 100@10V
Typical Gate Charge @ Vgs (nC) 6.9@10V Typical Gate Charge @ 10V (nC) 6.9
Typical Gate to Drain Charge (nC) 1.8 Typical Gate to Source Charge (nC) 1
Typical Reverse Recovery Charge (nC) 28 Typical Input Capacitance @ Vds (pF) 190@15V
Typical Reverse Transfer Capacitance @ Vds (pF) 61@15V Minimum Gate Threshold Voltage (V) 1
Typical Output Capacitance (pF) 120 Maximum Power Dissipation (mW) 2000
Typical Fall Time (ns) 3 Typical Rise Time (ns) 8.8
Typical Turn-Off Delay Time (ns) 13 Typical Turn-On Delay Time (ns) 6.2
Minimum Operating Temperature (°C) -55 Maximum Operating Temperature (°C) 150
Packaging Tube Typical Drain Source Resistance @ 25°C (mOhm) 60@10V|[email protected]
Maximum Power Dissipation on PCB @ TC=25°C (W) 2 Maximum Pulsed Drain Current @ TC=25°C (A) 16
Maximum Junction Ambient Thermal Resistance on PCB (°C/W) 62.5 Typical Diode Forward Voltage (V) 0.82
Typical Gate Plateau Voltage (V) 3.4 Typical Reverse Recovery Time (ns) 27
Maximum Diode Forward Voltage (V) 1.2 Maximum Positive Gate Source Voltage (V) 20
Maximum Continuous Drain Current on PCB @ TC=25°C (A) 3.5 Mounting Surface Mount
PCB changed 8 Pin Count 8
Lead Shape Gull-wing

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