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See Technical Specifications

THGAMRG7T13BAIL +BOM

Compact and efficient, this FBGA-eMMC ROHS product is ideal for a wide range of applications. ( character

Manufacturer:

Kioxia America, Inc.
Mfr.Part #:

THGAMRG7T13BAIL
Datasheet:

THGAMRG7T13BAIL Datasheet (PDF)
Part Life Cycle Code:

Obsolete
ECCN Code:

EAR99
HTS Code:

8542.32.00.51
JESD-30 Code:

R-PBGA-B153
EDA/CAD Models:

Request Free CAD Models for THGAMRG7T13BAIL

THGAMRG7T13BAIL General Description

The THGAMRG7T13BAIL is an exceptional NAND flash memory component that sets the standard for high-density and reliable storage solutions. With its 128 gigabit capacity and 3D BiCS FLASH technology, this device is well-suited for use in a variety of applications, including smartphones, tablets, and solid-state drives. Its high-speed data transfer rates and low power consumption make it particularly well-suited for mobile and battery-powered devices, offering users a seamless and efficient data storage experience

Specifications

Part Life Cycle Code	Obsolete	Reach Compliance Code
ECCN Code	EAR99	HTS Code	8542.32.00.51
JESD-30 Code	R-PBGA-B153	Length	13 mm
Memory Density	137438953472 bit	Memory IC Type	Embedded MMC
Memory Width	8	Number of Functions	1
Number of Terminals	153	Number of Words	17179869184 words
Number of Words Code	16000000000	Operating Mode	ASYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-25 °C
Organization	16GX8	Seated Height-Max	0.8 mm
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.7 V
Supply Voltage-Nom (Vsup)	3.3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Form	BALL	Terminal Pitch	0.5 mm
Terminal Position	BOTTOM	Type	NAND TYPE
Width	11 mm