This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

THGBMJG8C2LBAIL +BOM

THGBMJG8C2LBAIL FBGA-153 ROHS eMMC

THGBMJG8C2LBAIL General Description

FLASH - NAND Memory IC 256Gbit eMMC 153-WFBGA (11.5x13)

Specifications

Part Life Cycle Code Obsolete Reach Compliance Code
ECCN Code EAR99 HTS Code 8542.32.00.51
JESD-30 Code R-PBGA-B153 Length 13 mm
Memory Density 274877906944 bit Memory IC Type Embedded MMC
Memory Width 8 Number of Functions 1
Number of Terminals 153 Number of Words 34359738368 words
Number of Words Code 32000000000 Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min -25 °C
Organization 32GX8 Seated Height-Max 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Form BALL Terminal Pitch 0.5 mm
Terminal Position BOTTOM Type NAND TYPE
Width 11 mm

Service Policies and Others

After-Sales & Settlement Related

payment Payment

Payment Method

hsbc
TT/Wire Transfer
paypal
Paypal
wu
Western Union
mg
Money Gram

For alternative payment channels, please reach out to us at:

[email protected]
shipping Shipping & Packing

Shipping Method

fedex
Fedex
ups
UPS
dhl
DHL
tnt
NTN
Packing

AVAQ determines and packages all devices based on electrostatic discharge (ESD) and moisture sensitivity level (MSL) protection requirements.

Warranty Warranty

We promise to provide 365 days quality assurance service for all our products.

Reviews

You need to log in to reply. Sign In | Sign Up