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THGBMJG8C2LBAIL FBGA-153 ROHS eMMC
153-WFBGA (11.5x13)Manufacturer:
Kioxia America, Inc.
Mfr.Part #:
THGBMJG8C2LBAIL
Datasheet:
Part Life Cycle Code:
Obsolete
ECCN Code:
EAR99
HTS Code:
8542.32.00.51
JESD-30 Code:
R-PBGA-B153
EDA/CAD Models:
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FLASH - NAND Memory IC 256Gbit eMMC 153-WFBGA (11.5x13)
Part Life Cycle Code | Obsolete | Reach Compliance Code | |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
JESD-30 Code | R-PBGA-B153 | Length | 13 mm |
Memory Density | 274877906944 bit | Memory IC Type | Embedded MMC |
Memory Width | 8 | Number of Functions | 1 |
Number of Terminals | 153 | Number of Words | 34359738368 words |
Number of Words Code | 32000000000 | Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -25 °C |
Organization | 32GX8 | Seated Height-Max | 0.8 mm |
Supply Voltage-Max (Vsup) | 3.6 V | Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3.3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | OTHER |
Terminal Form | BALL | Terminal Pitch | 0.5 mm |
Terminal Position | BOTTOM | Type | NAND TYPE |
Width | 11 mm |
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